JPS6334275Y2 - - Google Patents
Info
- Publication number
- JPS6334275Y2 JPS6334275Y2 JP1983067884U JP6788483U JPS6334275Y2 JP S6334275 Y2 JPS6334275 Y2 JP S6334275Y2 JP 1983067884 U JP1983067884 U JP 1983067884U JP 6788483 U JP6788483 U JP 6788483U JP S6334275 Y2 JPS6334275 Y2 JP S6334275Y2
- Authority
- JP
- Japan
- Prior art keywords
- seal ring
- sealing
- solder
- package
- storage container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983067884U JPS59173342U (ja) | 1983-05-06 | 1983-05-06 | 半導体素子収納容器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983067884U JPS59173342U (ja) | 1983-05-06 | 1983-05-06 | 半導体素子収納容器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59173342U JPS59173342U (ja) | 1984-11-19 |
JPS6334275Y2 true JPS6334275Y2 (en]) | 1988-09-12 |
Family
ID=30198068
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1983067884U Granted JPS59173342U (ja) | 1983-05-06 | 1983-05-06 | 半導体素子収納容器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59173342U (en]) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5824446Y2 (ja) * | 1978-08-18 | 1983-05-25 | 日本電気株式会社 | 半導体装置 |
JPS55164847U (en]) * | 1979-05-16 | 1980-11-27 |
-
1983
- 1983-05-06 JP JP1983067884U patent/JPS59173342U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59173342U (ja) | 1984-11-19 |
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